Semiconductor device and method of fabricating the same
AssigneeFujian Jinhua Integrated Circuit Co., Ltd.
InventorsYifei Yan, Huixian Lai
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AssigneeFujian Jinhua Integrated Circuit Co., Ltd.
InventorsYifei Yan, Huixian Lai
Estimating the term…
The present disclosure relates to a semiconductor device and a fabricating method thereof, which includes a substrate and a plurality of word lines. The substrate includes a shallow trench isolation and an active structure defined by the shallow trench isolation and the active structure includes a first active area and a second active area. The first active area includes a plurality of active area units being parallel extended along a first direction, and the second active area is disposed outside a periphery of the first active area, to surround all of the active area units. The word lines are disposed in the substrate to intersect the active area units and the shallow trench isolation. The word lines includes first word lines arranged by a first pitch and second word lines arranged by a second pitch, and the second pitch is greater than the first pitch.
A semiconductor device, comprising;
Dependencies are inferred from the claim text.