Fingerprint recognition module

A fingerprint recognition module, comprising:

• a first dielectric layer, defined a first side and a second side, wherein an adaptor board is disposed on the first side, and two sides of the adaptor board are provided with first metal contact points and second metal contact points electrically connected to the first metal contact points;
• a processing unit, disposed on the first side, wherein the processing unit has first conducting pads, and each of the first conducting pads is for electrically connecting to one of the first metal contact points;
• a plurality of first sensing strings, disposed between the first dielectric layer and a second dielectric layer, electrically connected to conducting wires;
• and
• a plurality of second sensing strings, disposed between the second dielectric layer and a third dielectric layer, electrically connected to second conducting wires;
• wherein each of the first conducting wires are electrically connected to one of the third conducting wires through a first conducting pillar, and the second conducting wires and the third conducting wires are electrically connected to the second metal contact points;
• wherein the first metal contact points surround a first area, the second metal contact points surround a second area, and the first area is smaller than the second area.