Computer assisted weak pattern detection and quantification system

A system, comprising:

• at least one processor in communication with a wafer inspection tool and configured to receive detected defects from the wafer inspection tool, the at least one processor configured to:
• perform pattern grouping on the detected defects based on design of the wafer;
• perform a simulation to simulate effects of a wafer process tool on the wafer;
• analyze an output of the simulation to automatically identify regions of interest where patterns deviate from the design of the wafer;
• identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold;
• validate the identified weak patterns by:
• performing a pattern search process to define one or more hotspot inspection care areas around one or more of the identified weak patterns;
• reviewing defects within the one or more hotspot inspection care areas with at least one the wafer inspection tool or a second wafer inspection tool;
• and
• performing pattern fidelity measurements on the defects to determine local CD variation of the one or more identified weak patterns;
• report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.