Wafer map analyzer, method for analyzing wafer map using the same and method for manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsMin Chul Park, Jeong Hoon Ko, Ji Yong Park, Je Hyun Lee, Dae Sin Kim
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Abstract
A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.
Claims7
A method for analyzing a wafer map of a semiconductor wafer, the method comprising:
- generating first wafer maps each displaying characteristics of a corresponding first wafer for each of a plurality of channels;
- auto-encoding the first wafer maps simultaneously to extract a single first feature of the semiconductor wafer;
- determining whether the first feature is a valid pattern for classification;
- classifying a type of the first feature based on unsupervised learning when the first feature is a valid pattern by clustering into a clustered group a plurality of feature groups including the first feature;
- and
- extracting a representative image of features classified into the same type as the first feature by generating a feature of a cluster center of the clustered group and reconstructing the feature to extract the representative image,
- wherein each of the plurality of channels of the first wafer is determined by different parameters that differ from each other, and
- wherein each of the first wafer maps of the first wafer is generated with different patterns.
Dependencies are inferred from the claim text.