Integrated circuit, wireless communication card and wiring structure of identification mark
AssigneeAu Optronics Corporation
InventorsShyh-Bin Kuo, Hsiang-Chi Cheng, Sin-Jie Wang, Yi-Cheng Lai, Chung-Hung Chen, Shih-Hsing Hung
Life of this patent
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Abstract
An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.
Claims20
An integrated circuit, comprising:
- a memory;
- a power supply wiring;
- a ground wiring;
- at least one identification mark pattern respectively having a first conductive wiring and a second conductive wiring overlapping each other, wherein the first conductive wiring is electrically connected to the power supply wiring, and the second conductive wiring is electrically connected to the ground wiring,
- wherein the at least one identification mark pattern is identified by one of hollow portion and contour of the first conductive wiring of the at least one identification mark pattern, and the second conductive wiring of the at least one identification mark pattern is disposed between the first conductive wiring of the at least one identification mark pattern and a substrate,
- wherein the power supply wiring and the ground wiring are electrically connected to at least one rectifier, and a plurality of first channel directions, which are from a source to a drain, in a plurality of transistors of the memory are the same as a plurality of second channel directions, which are from the source to the drain, in a plurality of transistors of the at least one rectifier.
A wiring structure of an identification mark, comprising:
- a first wiring;
- a second wiring;
- at least one identification mark pattern respectively having a first conductive wiring and a second conductive wiring overlapping each other, wherein the first conductive wiring is electrically connected to the first wiring, and the second conductive wiring is electrically connected to the second wiring,
- wherein the at least one identification mark pattern is identified by one of hollow portion and contour of the first conductive wiring of the at least one identification mark pattern, and the second conductive wiring of the at least one identification mark pattern is disposed between the first conductive wiring of the at least one identification mark pattern and a substrate,
- wherein a transmittance rate of the at least one identification mark pattern is 90%>T %>10%.
An integrated circuit, comprising:
- a power supply wiring;
- a ground wiring;
- at least one identification mark pattern respectively having a first conductive wiring and a second conductive wiring overlapping each other, wherein the first conductive wiring is electrically connected to the power supply wiring, and the second conductive wiring is electrically connected to the ground wiring,
- wherein the at least one identification mark pattern is identified by one of hollow portion and contour of the first conductive wiring of the at least one identification mark pattern, and the second conductive wiring of the at least one identification mark pattern is disposed between the first conductive wiring of the at least one identification mark pattern and a substrate,
- wherein a transmittance rate of the at least one identification mark pattern is 90%>T %>10%.
Dependencies are inferred from the claim text.