Interface for semiconductor device and interfacing method thereof

An interfacing method for a semiconductor device, the semiconductor device including a master device and a plurality of slave devices, wherein the master device and the slave devices are stacked up with electric connection, the interfacing method comprising:

• implementing a master interface in the master device, the master interface including a master interface circuit with a master bond pattern;
• implementing a slave interface in each of the slave devices, the slave interface including a slave interface circuit with a slave bond pattern to correspondingly connect to the master bond pattern;
• and
• implementing a clock route, to transmit a clock signal through the master interface and the slave interface,
• wherein the master device transmits a command and a selecting slave identification through the master interface to all the slave interfaces;
• wherein one of the slave devices corresponding to the selecting slave identification executes the command and responds a result back to the master device through the slave interfaces and the master interface.