Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device

A binder resin comprising a structure in which a compound of the following Chemical Formula 1 and a dianhydride compound are polymerized:

• in Chemical Formula 1,
• L is —O—;
• a substituted or unsubstituted alkylene group;
• or a substituted or unsubstituted arylene group,
• l is an integer from 1 to 10,
• when l is 2 or higher, L's are the same as or different from each other,
• Ra and Rb are the same as or different from each other, and are each independently hydrogen;
• or a substituted or unsubstituted alkyl group,
• ra and rb are the same as or different from each other, and are each independently an integer from 0 to 4, and when ra is 2 or higher, Ra's are the same as or different from each other, and when rb is 2 or higher, Rb's are the same as or different from each other, and
• wherein the dianhydride compound is an oxydiphthalic anhydride (ODPA).