Display panel, display device and preparation method for display panel

A method for manufacturing a display panel, comprising the following steps:

• the step of forming a conductive structure layer on a side surface of a first substrate, wherein the conductive structure layer has a bonding region close to a side edge of the conductive structure layer;
• the step of stripping at least a part of the bonding region from the first substrate wherein the step further comprises:
• disposing a second substrate on the conductive structure layer, to make the bonding region be exposed outside the second substrate;
• irradiating the bonding region of the conductive structure layer and a part of the conductive structure layer close to the bonding region from the side of the first substrate away from the conductive structure layer by using laser, to strip a corresponding part of the conductive structure layer from the first substrate;
• and irradiating the part of the conductive structure layer close to the bonding region from a side of the second substrate away from the conductive structure layer by using laser, to strip a corresponding part of the conductive structure layer from the second substrate;
• the step of the cutting off a part of the first substrate stripped from the conductive structure layers and making a stripped part of the conductive structure layer protrude from a cut end surface of the first substrate, wherein the cutting off the part of the first substrate stripped from the conductive structure layer further comprises:
• positioning the stripped part of the conductive structure layer from a side where the second substrate is located by using an auxiliary fixture;
• and cutting off the part of the first substrate stripped from the conductive structure layer, wherein the second substrate protrudes from the cut end surface of the first substrate to form a protruding part;
• and
• the step of bending the stripped part of the conductive structure layer toward a side of the first substrate away from the conductive structure layers and fixing a bent part of the conductive structure layer on the cut end surface of the first substrate, wherein the step further comprises:
• disposing a mold on the cut end surface of the first substrate, wherein the mold has a molding surface allowing smooth transition of the bent part of the conductive structure layer;
• attaching the stripped part of the conductive structure layer on the molding surface to be bent filling a second fixing adhesive between the bent part of the conductive structure layer and the protruding part of the second substrate, and curing the second fixing adhesive;
• and removing the mold, filling a first fixing adhesive between the bent part of the conductive structure layer and the cut end surface of the first substrate, and curing the first fixing adhesive.