Optoelectronic computing platform

A system comprising:

• an integrated circuit interposer comprising:
• a first substrate comprising a plurality of sets of metal contacts on a surface of the first substrate, the plurality of sets of metal contacts comprising a first set of metal contacts and a second set of metal contacts;
• and
• one or more patterned waveguide layers that form one or more optical waveguides;
• a plurality of semiconductor dies electrically coupled to the plurality of sets of metal contacts on the first substrate, each semiconductor die comprising a semiconductor substrate and circuitry formed on the semiconductor substrate;
• wherein the plurality of semiconductor dies comprise a first semiconductor die and a second semiconductor die, the first semiconductor die comprises first circuitry, the second semiconductor die comprises second circuitry, the first semiconductor die is electrically coupled to the first set of metal contacts, the second semiconductor die is electrically coupled to the second set of metal contacts;
• wherein the first circuitry is configured to communicate optically with the second circuitry through the one or more optical waveguides.

An apparatus comprising:

• an interconnection module comprising:
• a first substrate;
• a first metal contact layer formed on the first substrate, in which the first metal contact layer comprises a first metal contact configured to be electrically coupled to a first die comprising circuitry;
• a patterned waveguide layer that comprises a plurality of individually photomask patterned waveguide sections disposed on the substrate, in which the patterned waveguide layer comprises a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections;
• a first modulator coupled to the first waveguide at a first location along the first waveguide and configured to modulate an optical signal traveling in the first waveguide based on a first electrical signal received at the first metal contact from the first die;
• and
• a second modulator coupled to the first waveguide at a second location along the first waveguide and configured to modulate the optical signal in the first waveguide based on a second electrical signal received at a second metal contact;
• wherein the first waveguide enables the optical signal to travel from a source location to a target location across the at least one boundary between individually photomask patterned waveguide sections and be modulated by the first and second modulators as the optical signal travels from the source location to the target location.

An apparatus comprising:

• an interposer comprising:
• an interposer substrate;
• a first metal contact layer formed on the interposer substrate, in which the first metal contact layer comprises a first metal contact, a second metal contact, and a third metal contact, the first metal contact is configured to be electrically coupled to a first die comprising circuitry, the second metal contact is configured to be electrically coupled to the first die, the first die comprising a first substrate different from the interposer substrate;
• a patterned waveguide layer formed on the interposer substrate, in which the patterned waveguide layer comprises a first waveguide;
• a first modulator coupled to the first waveguide at a first location along the first waveguide and configured to modulate an optical signal traveling in the first waveguide based on a first electrical signal received at the first metal contact to generate a first modulated optical signal;
• a second modulator coupled to the first waveguide at a second location along the first waveguide and configured to modulate the first modulated optical wave in the first waveguide based on a second electrical signal received at the second metal contact to generate a second modulated optical signal;
• a detector configured to detect the second modulated optical signal to generate a detected signal;
• and
• detection circuitry configured to map a detected characteristic of the detected signal to an output signal using a predetermined scale that indicates a number of modulators by which the signal was modulated in a predetermined manner, in which the output signal is electrically coupled to the third contact.

An apparatus comprising:

• an interposer comprising:
• an interposer substrate;
• a first metal contact layer formed on the interposer substrate, in which the first metal contact layer comprises a first metal contact, a second metal contact, and a third metal contact, the first metal contact is configured to be electrically coupled to a first die comprising circuitry, the second metal contact is configured to be electrically coupled to a second die comprising circuitry, the first die comprising a first substrate different from the interposer substrate, the second die comprising a second substrate different from the interposer substrate;
• a patterned waveguide layer formed on the interposer substrate, in which the patterned waveguide layer comprises a first waveguide;
• a first modulator coupled to the first waveguide at a first location along the first waveguide and configured to modulate an optical signal traveling in the first waveguide based on a first electrical signal received at the first metal contact to generate a first modulated optical signal;
• a second modulator coupled to the first waveguide at a second location along the first waveguide and configured to modulate the first modulated optical wave in the first waveguide based on a second electrical signal received at the second metal contact to generate a second modulated optical signal;
• a detector configured to detect the second modulated optical signal to generate a detected signal;
• and
• detection circuitry configured to map a detected characteristic of the detected signal to an output signal using a predetermined scale that indicates a number of modulators by which the signal was modulated in a predetermined manner, in which the output signal is electrically coupled to the third contact.