Semiconductor package, optical device and method of fabricating the same

A semiconductor package, comprising:

• a photonic die, comprising:
• a substrate;
• a dielectric layer disposed on the substrate;
• a core layer disposed on the dielectric layer, wherein the core layer comprises a waveguide structure comprising:
• a first slab structure and a second slab structure;
• a waveguide array optically coupled to the first slab structure and the second slab structure, wherein the waveguide array comprises:
• a plurality of waveguide channels connected to and overlapped with a first connecting surface of the first slab structure in a first connecting region on the dielectric layer, and connected to and overlapped with a second connecting surface of the second slab structure in a second connecting region on the dielectric layer;
• and
• at least one auxiliary channel spaced apart from and non-overlapped with the first connecting surface of the first slab structure in the first connecting region, and spaced apart from and non-overlapped with the second connecting surface of the second slab structure in the second connecting region, wherein the at least one auxiliary channel is optically coupled to the first slab structure and the second slab structure, and
• wherein the plurality of waveguide channels and the at least one auxiliary channel extends from the first slab structure to the second slab structure in an interconnection region on the dielectric layer, wherein the interconnection region separates the first connecting region from the second connecting region;
• a protection layer disposed on the dielectric layer and covering the core layer;
• and
• an interconnection layer disposed over the protection layer;
• an electronic die disposed on the photonic die and electrically coupled to the photonic die.

A method of fabricating an optical device, comprising:

• providing a substrate;
• forming a core material over the substrate;
• patterning the core material to form a core layer, wherein patterning the core material comprises:
• patterning the core material to define a first slab structure and a second slab structure;
• patterning the core material to form an input array connected to the first slab structure and an output array connected to the second slab structure;
• patterning the core material to form a waveguide array optically coupled to the first slab structure and the second slab structure, wherein patterning the core material to form the waveguide array comprises:
• forming a first connecting part joined with the first slab structure;
• forming a second connecting part joined with the second slab structure, wherein the second connecting part comprises a central portion and at least one flank portion that are located over a connecting surface of the second slab structure, the central portion is physically connected to and overlapped with the connecting surface of the second slab structure, and the at least one flank portion is physically joined with the central portion and is overhanging a side surface of the second slab structure while being physically separated from the side surface of the second slab structure;
• and
• forming a plurality of waveguide channels joining the first connecting part to the second connecting part;
• and
• forming a protection layer over the dielectric layer and covering the core layer.