US 11,686,818 B2Granted

Mounting configurations for optoelectronic components in LiDAR systems

AssigneeCepton Technologies, Inc.

InventorsMark Armstrong McCord, Roger David Cullumber, Jun Pei, Henrik K. Nielsen

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Abstract

A LiDAR system includes a first optical lens, and one or more first optoelectronic packages spaced apart from the first optical lens along the optical axis of the first optical lens. Each respective first optoelectronic package includes a first plurality of optoelectronic components positioned on the respective first optoelectronic package such that a surface of each respective optoelectronic component lies substantially on the first surface of best focus. The LiDAR system further includes a second optical lens, and one or more second optoelectronic packages spaced apart from the second optical lens along the optical axis of the second optical lens. Each respective second optoelectronic package includes a second plurality of optoelectronic components positioned on the respective second optoelectronic package such that a surface of each respective optoelectronic component lies substantially on the second surface of best focus.

A LiDAR system comprising:

a first optical lens characterized by a first optical axis, a first lens center, and a first surface of best focus;
a first optoelectronic package spaced apart from the first optical lens along the first optical axis, the first optoelectronic package comprising a first plurality of optoelectronic components positioned on a first substrate;
a printed circuit board (PCB), wherein the first optoelectronic package is mounted on the printed circuit board;
a second optoelectronic package mounted on the PCB, the second optoelectronic package comprising:
a second substrate spaced apart from the first optical lens along the first optical axis;
and
a second plurality of optoelectronic components positioned on the second substrate, wherein surfaces of respective optoelectronic components of the second plurality of optoelectronic components lie substantially on the first surface of best focus;
an interposer mounting the first optoelectronic package on the PCB, wherein:
the interposer mounts the first optoelectronic package at a different height from the PCB than a height that the second optoelectronic package is mounted from the PCB, so that surfaces of respective optoelectronic components of the first plurality of optoelectronic components lie substantially on the first surface of best focus;
and
the first surface of best focus is curved;
a second optical lens characterized by a second optical axis, a second lens center, and a second surface of best focus;
and
a third optoelectronic package spaced apart from the second optical lens along the second optical axis, the third optoelectronic package comprising a third plurality of optoelectronic components positioned on a third substrate, separate from the first substrate, such that a surface of each respective optoelectronic component of the third plurality of optoelectronic components lies substantially on the second surface of best focus, wherein the second surface of best focus is curved.

11 more elements

Facts

Application

16/828,366Filed 24 Mar 2020 · us provisional application

Priority

25 Mar 2019

Published

US 2020/0309910 A11 Oct 2020

Granted

27 Jun 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification16 codes

G01S 7/481
Of systems according to group G01S17/00: constructional features, e.g. arrangements of optical elements
G01S 7/4815
Of transmitters alone: using multiple transmitters
G01S 7/4816
Constructional features, e.g. arrangements of optical elements: of receivers alone
G01S 17/08
Systems determining position data of a target: for measuring distance only

Abstract

Claims25