Die extraction method

A die extraction method for extracting a target die from multiple die layers in an integrated circuit sample, the method comprising the following steps:

• removing solder balls from a back side of the integrated circuit sample;
• attaching the back side of the integrated circuit sample to a polishing jig, and flattening the integrated circuit sample and the polishing jig by a flattener;
• polishing a front side of the integrated circuit sample to remove a part on a front side of the target die, and retain a part of a die attach film (DAF) layer on the front side of the target die and a bonding wire located in the part;
• attaching the front side of the integrated circuit sample to the polishing jig and flattening the integrated circuit sample and the polishing jig by the flattener;
• polishing the back side of the integrated circuit sample to remove a part on a back side of the target die, and retain a DAF layer on the back side of the target die;
• removing the DAF and a packaging material remaining on the integrated circuit sample to obtain the target die;
• and
• attaching the back side of the target die to a glass slide, thus completing extraction of the target die.