Integrated circuit manufacture and outlier detection

An integrated circuit method, comprising:

• processing a plurality of parametric data for each integrated circuit die in a plurality of integrated circuit die to determine an expected data pattern corresponding to the plurality of integrated circuit die;
• screening a predetermined integrated circuit die by comparing a data pattern corresponding to a plurality of parametric data for the predetermined integrated circuit die to the expected data pattern, wherein the comparing compares a slope of the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die to a slope of the expected data pattern;
• and
• responsive to the comparing determining that a difference between the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die and the expected data pattern is beyond a tolerance, identifying the beyond a tolerance predetermined integrated circuit die as an outlier, wherein the responsive step comprises determining whether a difference between the slope of the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die and the slope of the expected data pattern is beyond a tolerance.

A nontransitory computer-readable program storage medium having stored thereon program instructions that when executed by processing logic have the processing logic capable of:

• processing a plurality of parametric data for each integrated circuit die in a plurality of integrated circuit die to determine an expected data pattern corresponding to the plurality of integrated circuit die;
• screening a predetermined integrated circuit die by comparing a data pattern corresponding to a plurality of parametric data for the predetermined integrated circuit die to the expected data pattern;
• and
• responsive to the comparing determining that a difference between the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die and the expected data pattern is beyond a tolerance, identifying the beyond a tolerance predetermined integrated circuit die as an outlier.

A nontransitory computer-readable program storage medium having stored thereon program instructions that when executed by processing logic have the processing logic capable of:

• processing a plurality of parametric data for each integrated circuit die in a plurality of integrated circuit die to determine an expected data pattern corresponding to the plurality of integrated circuit die;
• screening a predetermined integrated circuit die by comparing a data pattern corresponding to a plurality of parametric data for the predetermined integrated circuit die to the expected data pattern, wherein the comparing compares a slope of the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die to a slope of the expected data pattern;
• and
• responsive to the comparing determining that a difference between the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die and the expected data pattern is beyond a tolerance, identifying the beyond a tolerance predetermined integrated circuit die as an outlier, wherein the responsive step comprises determining whether a difference between the slope of the data pattern corresponding to the plurality of parametric data for the predetermined integrated circuit die and the slope of the expected data pattern is beyond a tolerance.

A method of producing integrated circuits, comprising:

• fabricating a plurality of integrated circuit die;
• packaging each integrated circuit in the plurality of integrated circuit die;
• measuring a plurality of parametric data as one or more steps either during the fabricating or packaging of each integrated circuit die;
• processing, in a neural network, the plurality of parametric data for each integrated circuit die to determine an expected data pattern corresponding to the plurality of integrated circuit die;
• screening each integrated circuit die by comparing a data pattern corresponding to the plurality of parametric data for each integrated circuit die to the expected data pattern;
• and
• responsive to the comparing determining that a difference between the data pattern corresponding to a plurality of parametric data for a predetermined integrated circuit die and the expected data pattern is beyond a tolerance, identifying the beyond a tolerance integrated circuit die as an outlier.

A method of producing integrated circuits, comprising:

• fabricating a plurality of integrated circuit die;
• packaging each integrated circuit in the plurality of integrated circuit die;
• measuring a plurality of parametric data as one or more steps either during the fabricating or packaging of each integrated circuit die;
• processing, in a neural network, the plurality of parametric data for each integrated circuit die to determine an expected data pattern corresponding to the plurality of integrated circuit die;
• screening each integrated circuit die by comparing a data pattern corresponding to the plurality of parametric data for each integrated circuit die to the expected data pattern, wherein the comparing compares a slope of the data pattern corresponding to the plurality of parametric data for each integrated circuit die to a slope of the expected data pattern;
• and
• responsive to the comparing determining that a difference between the data pattern corresponding to a plurality of parametric data for a predetermined integrated circuit die and the expected data pattern is beyond a tolerance, identifying the beyond a tolerance integrated circuit die as an outlier, wherein the responsive step comprises determining whether a difference between the slope of the data pattern corresponding to the plurality of parametric data for each integrated circuit die and the slope of the expected data pattern is beyond a tolerance.