Multi-prober chuck assembly and channel
AssigneeKorea Institute of Industrial Technology
InventorsKyung Tae Nam, Seung Joon Lee, Kwang Hee Lee
Life of this patent
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Abstract
A multi-prober chuck assembly and channel are provided. The multi-prober chuck assembly, according to one embodiment of the present invention, comprises: a chuck for supporting a wafer; a probe card structure coupled to the top part of the chuck; a heater for heating the chuck under the chuck; a conductive guard plate spaced apart from the heater below the heater; and a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part, wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure.
Claims20
A multi-prober chuck assembly, comprising:
- a chuck for supporting a wafer;
- a probe card structure coupled to the top part of the chuck;
- a heater for heating the chuck under the chuck;
- a conductive guard plate spaced apart from the heater below the heater;
- and
- a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part,
- wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure, and
- wherein the conductive guard plate is formed in two or more, and the two or more conductive guard plates are disposed spaced apart side by side from each other, and the chuck and the conductive guard plate are electrically separated and spaced apart by an insulating non-conductor.
A multi-prober chuck assembly, comprising:
- a chuck for supporting a wafer;
- a probe card structure coupled to the top part of the chuck;
- a heater for heating the chuck under the chuck;
- a conductive guard plate spaced apart from the heater below the heater;
- and
- a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part,
- wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure,
- wherein the probe card structure comprises a substrate;
- a probe formed on the substrate and disposed to face the wafer on the chuck;
- and a reinforcement part for supporting the substrate,
- wherein the chuck assembly further comprises a locking part formed between the reinforcement part and the body part, and
- wherein the locking part comprises an upper locker formed under the reinforcement part and a lower locker formed over the body part, and fastening parts that can be mutually fastened by relative rotation between the probe card structure and the body part are formed on the upper locker and the lower locker.
Dependencies are inferred from the claim text.