Inspection apparatus and manufacturing method for semiconductor device

An inspection apparatus inspecting a wafer on which a plurality of patterns are formed by a plurality of exposure shots, the inspection apparatus comprising:

• an acquisition unit configured to acquire first information representing a positional relation between an inspection mark included in a pattern formed by a first exposure shot and an inspection mark included in a pattern formed by a second exposure shot, and second information representing a positional relation between the inspection mark included in the pattern formed by the second exposure shot and an inspection mark included in a pattern formed by a third exposure shot;
• and
• a derivation unit configured to derive a linear component of an error caused by a reticle, and a linear component of an error caused by a position of a wafer, on the basis of the first information and the second information,
• wherein the derivation unit is configured to:
• tentatively derive the linear component of an error caused by the reticle on the basis of the first information and the second information;
• derive the linear component of an error caused by the position of the wafer on the basis of a value obtained by subtracting a value, which corresponds to the tentatively-derived linear component, from a value which corresponds to the first information and the second information;
• and
• derive the linear component of an error caused by the reticle on the basis of a value obtained by subtracting a value, which corresponds to the linear component of an error caused by the wafer, from a value which corresponds to the first information and the second information.