Photoacoustic sensors and associated production methods
AssigneeInfineon Technologies AG
InventorsHorst Theuss, Rainer Markus Schaller
Life of this patent
Estimating the term…
Abstract
A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.
Claims25
A photoacoustic sensor, comprising:
- a first layer with an optical MEMS emitter;
- a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are arranged offset laterally with respect to one another;
- and
- a third layer stacked over the second layer with a cavity for a reference gas,
- wherein the optical MEMS emitter is configured to transmit optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is arranged outside a course of the optical path.
A photoacoustic sensor, comprising:
- an emitter component, comprising:
- a first layer with an optical MEMS emitter, and
- a cover arranged over the first layer;
- and
- a pressure pick-up component separate from the emitter component, comprising:
- a second layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are arranged offset laterally with respect to one another, and
- a third layer stacked over the second layer with a cavity for a reference gas,
- wherein the optical MEMS emitter is configured to transmit optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is arranged outside a course of the optical path.
A method for producing a photoacoustic sensor, wherein the method comprises:
- providing a first layer with an optical MEMS emitter;
- stacking a second layer with a MEMS pressure pick-up and an optically transparent window over the first layer, wherein the MEMS pressure pick-up and the optically transparent window are arranged offset laterally with respect to one another;
- and
- stacking a third layer with a cavity for a reference gas over the second layer,
- wherein the optical MEMS emitter is configured to transmit optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity, and wherein the MEMS pressure pick-up is arranged outside a course of the optical path.
Dependencies are inferred from the claim text.