Thermopile module
AssigneePixart Imaging Inc.
InventorsMing-Han Tsai, Chih-Ming Sun, Jian-Cheng Liao
Life of this patent
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Abstract
An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
Claims17
An electronic device, comprising:
- an outer case having an opening;
- a circuit substrate disposed inside the outer case;
- a thermopile sensor chip disposed on the circuit substrate and facing the opening;
- a filter structure disposed outside the outer case;
- and
- a waterproof structure surroundingly connected between the filter structure and the outer case.
An electronic device, comprising:
- an outer case having an opening;
- a circuit substrate disposed inside the outer case;
- a thermopile sensor chip disposed on the circuit substrate;
- and
- a waterproof structure disposed on the outer case.
Dependencies are inferred from the claim text.