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US 11,686,539 B2Granted
Coldplate with heat transfer module
AssigneeRaytheon Company
InventorsJames S. Wilson, James Giesey
Life of this patent
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Abstract
A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.
Claims20
A coldplate assembly, comprising:
- a base;
- a first conduit module of a first predetermined length having a first opening and a second opening;
- a first heat conducting structure provided within the first conduit module;
- a cover coupled to the base to capture the first conduit module between the base and the cover and to enclose and define a first manifold cavity between the base and the cover, wherein the cover and base include one or more interconnects linearly arranged between the cover and the base,
- wherein the first opening of the first conduit module is disposed in the first manifold cavity, and
- wherein the first opening of the first conduit module is sealed, about a portion of its periphery, a respective first sealing length, less than the first conduit module predetermined length, from the first opening toward the second opening.
3 more elements
A coldplate assembly, comprising:
- a base;
- a cover;
- a first conduit module of a first predetermined length comprising:
- a first opening;
- a second opening;
- and
- a heat conducting structure provided within the first conduit module;
- the cover coupled to the base to capture the first conduit module between the base and cover and to form first and second enclosed manifold cavities between the base and the cover, wherein the cover and base include one or more interconnects linearly arranged between the cover and the base,
- wherein the first opening of the first conduit module is disposed within the first manifold cavity and the second opening of the first conduit module is disposed within the second manifold cavity,
- wherein the first opening of the first conduit module is sealed, about a portion of its respective periphery within the first manifold cavity, a respective first sealing length, less than the first conduit module predetermined length, from the respective first opening toward the respective second opening,
- wherein the respective second opening of the first conduit module is sealed, about a portion of its respective periphery within the second manifold cavity, a respective second sealing length, less than the first conduit module predetermined length, from the respective second opening toward the respective first opening, and
- wherein the first and second manifold cavities are fluidly coupled to one another by the first conduit module.
9 more elements
Dependencies are inferred from the claim text.