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US 11,686,008 B2Granted
Electroplating apparatus and electroplating method
AssigneeUnimicron Technology Corp.
InventorsHeng-Ming Nien, Chih-Chiang Lu, Cho-Ying Wu, Shih-Lian Cheng
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Abstract
An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.
Claims19
An electroplating apparatus, comprising:
- an anode and a cathode;
- a power supply, electrically connected to the anode and the cathode;
- and
- a regulating plate, arranged between the anode and the cathode, wherein the regulating plate comprises an insulating grid plate and a plurality of magnetic components, and the plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate.
1 more element
An electroplating method, comprising:
- providing an electroplating apparatus, wherein the electroplating apparatus comprises:
- an anode and a cathode,
- a power supply, electrically connected to the anode and the cathode;
- and
- a regulating plate, arranged between the anode and the cathode, wherein the regulating plate comprises an insulating grid plate and a plurality of magnetic components, and the plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate;
- fixing a substrate to be plated to the cathode, wherein the substrate to be plated comprises a dry film, the dry film has at least a first opening and a second opening, and the first opening is smaller than the second opening;
- forming a plurality of electric force lines moving from the anode toward the cathode after the power supply supplies power;
- by the plurality of electric force lines, being passed through the regulating plate and divergently moving with a plurality of incident angles, such that the number of electric force lines entering the first opening is less than the number of electric force lines entering the second opening;
- and
- forming a metal plating layer on the substrate to be plated.
7 more elements
Dependencies are inferred from the claim text.