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US 11,686,007 B2Granted
Tin-indium alloy electroplating solution
AssigneeNew Mexico Tech University Research Park Corporation
InventorsBhaskar S. Majumdar, Sherin Bhassyvasantha, Luke Soule
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Abstract
The disclosure provides a Sn—In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn—In alloy film on a Cu substrate effectively mitigates whisker growth.
Claims18
An aqueous electroplating solution comprising:
- (a) a source of indium, wherein the source of indium is present in the aqueous electroplating solution in an amount of from about 0.002 mol/L to about 0.012 mol/L;
- (b) a source of tin, wherein the source of tin is sodium stannate trihydrate, wherein the source of tin is present in the aqueous electroplating solution in an amount of from about 0.01 mol/L to about 0.10 mol/L;
- (c) an organic complexing agent comprising a nitrogenous complexing agent;
- (d) a pH stabilizer, wherein the pH stabilizer is present in the aqueous electroplating solution in an amount of from about 0.02 mol/L to about 0.2 mol/L;
- and
- (e) an inorganic complexing agent, wherein the inorganic complexing agent is present in the aqueous electroplating solution in an amount of from about 0.2 mol/L to about 0.8 mol/L;
- wherein the electroplating solution has a pH from about 1 to about 2.
4 more elements
Dependencies are inferred from the claim text.