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US 11,686,006 B2Granted
Method of enhancing copper electroplating
AssigneeRohm and Haas Electronic Materials LLC
InventorsAlejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
Life of this patent
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Abstract
Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
Claims12
A method comprising:
- a) providing a substrate comprising copper;
- b) selectively applying a composition to the copper of the substrate to increase exposed copper grains having crystal plane (111) orientations, wherein the composition consists of water, a crystal plane (111) orientation enrichment compound, optionally a pH adjusting agent, an oxidizing agent and optionally a surfactant;
- c) electroplating copper on the copper of the substrate having increased exposed copper grains having crystal plane (111) orientations and field copper of the substrate with a copper electroplating bath, wherein copper electroplated on the copper treated with the composition electroplates at a faster rate than copper electroplated on the field copper;
- and
- d) anisotropic etching the copper plated on the copper of the substrate having increased exposed copper grains having crystal plane (111) orientations and simultaneously anisotropic etching the field copper, wherein the field copper is etched at a faster rate than the copper plated on the copper of the substrate having increased exposed copper grains having crystal plane (111) orientations.
2 more elements
Dependencies are inferred from the claim text.