Heat resistant polyimide film

A heat resistant polyimide film, characterized in that:

• the polyimide film is manufactured by:
• 100 parts by weight of polyimide solution;
• 10 parts to 40 parts by weight of inorganic filler modifier;
• and 0.1 parts to 5 parts by weight of interface coupling agent,
• wherein the inorganic filler modifier consists of silicon dioxide (silica)-based substance and substance for increasing interface bonding, and the mass ratio of the silica-based substance and the substance for increasing interface bonding is 1:(0.1-0.5),
• the silica-based substance is hollow ceramic microspheres, fumed silica (silicon dioxide in gaseous state), fused silica (melted silicon dioxide) or amorphous silica,
• the substance for increasing interface bonding is one or a mixture of two or more selected from the group consisting of:
• aluminum hydroxide, magnesium hydroxide, molybdenum oxide, aluminum nitride, aluminum oxide, boron nitride and silicon carbide,
• the polyimide solution comprises polyimide which has a structural formula of:
• Where n is an integer from 1 to 19;
• wherein Ar1 has a structural formula of:
• wherein Ar2 has a structural formula of:
• wherein R1 is O or NH.