Resin composition, cured product, laminate, and electronic member

A cured product which is obtained by curing a resin composition, wherein the resin composition contains an epoxy compound A having a structure of the general formula (1) below and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a curing accelerator:

• wherein, in the formula (1), each Ar independently represents a structure having an aromatic ring being unsubstituted or having a substituent,
• each of R1 and R2 independently represents a hydrogen atom or an alkyl group having 1 or 2 carbon atoms,
• each of R3 to R8 independently represents a hydroxyl group, a glycidyl ether group and/or a 2-methylglycidyl ether group, wherein at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group,
• each of R9 to R12 independently represents a hydrogen atom or a methyl group,
• n is an integer of 11 to 16, and
• m, p1, p2, and q are an average of the number of repeating units, and m is 0.5 to 25,
• each of p1 and p2 is independently 0 to 5, and
• q represents 0.5 to 5,
• wherein the individual repeating units present in the repeating units of the structure are the same or different.