Capping plate for panel scale packaging of MEMS products
AssigneeObsidian Sensors, Inc.
InventorsJohn Hong, Tallis Chang, Edward Chan, Bing Wen, Yaoling Pan, Kenji Nomura
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Abstract
A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.
Claims19
A method of manufacturing microelectromechanical systems (“MEMS”) products comprising:
- providing glass spacers;
- depositing an anti-reflective coating on the glass spacers;
- coupling a wavelength-specific transmissive window to the anti-reflective coating;
- providing a window plate;
- attaching the window plate to the glass spacers;
- aligning the glass spacers with a MEMS device glass plate;
- bonding the glass spacers to the MEMS device glass plate;
- and
- singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products.
A method of manufacturing MEMS products comprising:
- providing glass spacers;
- providing a window plate;
- attaching the window plate to the glass spacers;
- aligning the glass spacers with a MEMS device glass plate;
- bonding the glass spacers to the MEMS device glass plate;
- and
- singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products,
- wherein providing the glass spacers and providing the window plate comprises etching an array of wells in a plurality of silicon wafers,
- wherein attaching the window plate to the glass spacers and aligning the glass spacers with a MEMS device glass plate comprises:
- coupling a release layer to a handling plate;
- coupling, to the release layer, the plurality of silicon wafers so that the array of wells is distal to the release layer;
- and
- coupling, to the MEMS device glass plate, the plurality of silicon wafers so that the array of wells is proximal to the MEMS device glass plate;
- wherein bonding the glass spacers to the MEMS device glass plate comprises bonding the plurality of silicon wafers to the MEMS device glass plate, and
- wherein singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS devices comprises:
- decoupling the release layer from the plurality of silicon wafers;
- and
- singulating the MEMS products from the bonded MEMS device and plurality of silicon wafers.
A method of manufacturing MEMS products comprising:
- providing glass spacers;
- providing a window plate;
- attaching the window plate to the glass spacers;
- aligning the glass spacers with a MEMS device glass plate;
- bonding the glass spacers to the MEMS device glass plate;
- singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products;
- depositing a getter material on the glass spacers and window plate;
- and
- dry-etching the getter material from the window plate.
Dependencies are inferred from the claim text.