Sensor and package assembly thereof

A package assembly of a sensor, comprising:

• a redistribution layer comprising a first face and a second face opposite to each other;
• a first die electrically connected to the first face of the redistribution layer;
• a molding compound comprising a third face and a fourth face on opposite sides of the molding compound from each other, wherein the third face of the molding compound is combined with the first face of the redistribution layer such that the third face of the molding compound and the first face of the redistribution layer contact one another, and the molding compound encapsulates the first die on the side of the first face of the redistribution layer;
• and
• a sensing element electrically connected to the redistribution layer;
• and
• a casing mounted on the second face of the redistribution layer in such a way that a first space is formed between the casing and the second face of the redistribution layer,
• wherein the sensing element is located in the first space, and
• wherein the casing defines a first air vent for communication between the first space and an exterior of the package assembly.