Method of manufacturing wafer mounting table
AssigneeNGK Insulators, Ltd.
InventorsKazuhiro Nobori, Takuji Kimura
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Abstract
A method of manufacturing a wafer mounting table according to an embodiment includes: (a) a step of loading a ceramic slurry containing a ceramic powder and a gelling agent into opening portions of a metal mesh, inducing a chemical reaction of the gelling agent to gelate the ceramic slurry, and then performing degreasing and calcining to prepare a ceramic-loaded mesh; (b) a step of sandwiching the ceramic-loaded mesh between a first ceramic calcined body and a second ceramic calcined body obtained by calcining after mold cast forming so as to prepare a multilayer body; and (c) a step of hot press firing the multilayer body to prepare the wafer-receiving table.
Claims4
A method of manufacturing a wafer mounting table, the method comprising:
- (a) a step of loading a ceramic slurry containing a ceramic powder and a gelling agent into opening portions of a metal mesh, inducing a chemical reaction of the gelling agent to gelate the ceramic slurry, and then performing degreasing and calcining to prepare a ceramic-loaded mesh;
- (b) a step of sandwiching the ceramic-loaded mesh between, and in direct contact with a first ceramic calcined body and a second ceramic calcined body obtained by calcining after mold cast forming so as to prepare a multilayer body;
- and
- (c) a step of hot press firing the multilayer body to prepare a wafer-receiving table.
Dependencies are inferred from the claim text.