Method and system for performing chemical mechanical polishing

A method, comprising:

• providing a polishing pad;
• providing a slurry including abrasive particles and a chemical solution;
• providing a conditioning disk for conditioning a polishing pad of a chemical mechanical polishing system, wherein the conditioning disk has a bottom surface comprising at least one engraved region and a non-engraved region adjacent to the engraved region, and the engraved region and the non-engraved region are made of the same material;
• conditioning the polishing pad using the conditioning disk;
• and
• applying a vacuum suction force over the polishing pad for collecting the abrasive particles through at least one vacuum hole disposed on the non-engraved region of the bottom surface of the conditioning disk.

A chemical mechanical polishing system, comprising:

• a polishing pad;
• a carrier head including a retainer ring to retain a wafer proximate to the polishing pad during polishing, wherein a bottom surface of the retainer ring has a plurality of protrusions and a substantially flat region surrounding the protrusions, and the protrusions and the substantially flat region are monolithic, and the protrusions and the substantially flat region are at the same level height;
• and
• a conditioning disk over the polishing pad, wherein the conditioning disk comprises at least one vacuum hole disposed on a non-engraved region of a bottom surface of the conditioning disk.