Planarized membrane and methods for substrate processing systems
AssigneeAxus Technology, LLC
InventorDaniel Ray Trojan
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Abstract
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in chemical mechanical planarization of a wafer. The method further includes finishing the surface of a wafer with the planarized membrane.
Claims26
A method for processing a resilient membrane for a substrate carrier, the method comprising:
- providing the resilient membrane;
- planarizing a surface of the resilient membrane by a membrane conditioning tool to form a planarized resilient membrane;
- providing a support plate to support the membrane;
- and
- providing a holding element to hold the membrane to the support plate.
An apparatus for supporting a substrate, comprising:
- a membrane comprising a planarized surface, wherein the membrane is planarized by a membrane conditioning tool to reduce a surface roughness of the membrane;
- a support plate configured to support the membrane;
- and
- a holding element configured to hold the membrane to the support plate.
A membrane for chemical mechanical planarization, comprising:
- a resilient membrane body comprising a substrate facing surface and a carrier facing surface, wherein the substrate facing surface is planarized to have a surface roughness within a predetermined range that increases sealing between the membrane and a wafer.
A membrane for chemical mechanical planarization, comprising:
- a resilient membrane body comprising:
- a planarized substrate facing surface with a substrate surface roughness;
- and
- a carrier facing surface, with a carrier surface roughness, wherein the substrate surface roughness is less than the carrier surface roughness.
Dependencies are inferred from the claim text.