US 11,684,999 B2 · Laser irradiation apparatus

Abstract

To realize a laser irradiation apparatus by using which accuracy in processing a substrate can be improved. A laser irradiation apparatus according to an embodiment includes a laser irradiation unit configured to apply laser light to a substrate, a base part, and a conveyance stage configured to convey the substrate. The conveyance stage includes a stage configured to be movable over the base part, a base flange fixed over the stage, a substrate stage fixed to an upper end part of the base flange and configured so that the substrate is placed thereover, and a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down.

Drawings

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Drawings

Claims14

Dependent claims

A laser irradiation apparatus comprising:

a laser irradiation unit configured to apply laser light to a substrate;
a base part;
and
a conveyance stage configured to convey the substrate, wherein the conveyance stage comprises:
a stage configured to be movable above the base part;
a base flange fixed to an upper surface of the stage;
a substrate stage fixed to an upper end part of the base flange so that a center of the substrate stage is disposed on a rotational axis of the base flange extending in a vertical direction, the substrate stage being configured so that the substrate is placed thereover;
a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down;
and
a driving unit configured to move the pusher pin up and down, the driving unit being directly fixed to a bottom surface of the substrate stage, and
wherein the base flange rotatably supports the substrate stage about the rotational axis extending in the vertical direction.

8 more elements

Dependencies are inferred from the claim text.

Description8,184 words

Summary252 words

#The present invention relates to a laser irradiation apparatus.

#Patent Literature 1 discloses a laser irradiation apparatus that lifts/lowers a substrate by a pusher pin when transferring the substrate between a robot and a substrate stage.

#Patent Literature 1: Japanese Unexamined Japanese Application Publication No. 2006-5032

Brief description of the drawings24 figures

#FIG. 1 is side view schematically showing a laser irradiation apparatus according to a first embodiment;

#FIG. 2 is a plan view schematically showing the laser irradiation apparatus according to the first embodiment;

#FIG. 3 is a diagram for explaining a connection configuration of a base flange according to the first embodiment;

Detailed description7,390 words

#Specific embodiments will be described hereinafter with reference to the drawings. Note that the present invention is not to be limited to the embodiments described hereinafter. Further, the description and drawings mentioned hereinafter are simplified as appropriate for the sake of clarifying the explanation.

#First, an overall configuration of a laser irradiation apparatus according to this embodiment is explained. FIG. 1 is a side view schematically showing the laser irradiation apparatus according to this embodiment. FIG. 2 is a plan view schematically showing the laser irradiation apparatus according to this embodiment. Note that in FIGS. 1 and 2, the laser irradiation apparatus is shown in a simplified manner. Hereinbelow, an XYZ orthogonal coordinate system is used for the sake of clarifying the explanation. Here, the Z-axis direction is a vertical direction and the XY plane is a horizontal plane.

#A laser irradiation apparatus 1 is suitable for an excimer-laser annealing apparatus by which laser light is applied to an amorphous semiconductor formed in a substrate S to thereby form a polycrystalline semiconductor. Alternatively, the laser irradiation apparatus 1 may be applied to a laser release apparatus by which a release layer formed to the substrate S is released by applying a laser light thereto. Here, the substrate S may be, for example, formed of a glass substrate.

Facts

Application

16/632,344Filed 25 Aug 2017

Published

US 2020/0180071 A111 Jun 2020

Granted

27 Jun 2023

Term ends

9 Dec 2038

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment, including 471 days of adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification13 codes

B23K 26/08
Working by laser beam, e.g. welding, cutting or boring: devices involving relative movement between laser beam and workpiece
B23K 26/082
Devices involving relative movement between laser beam and workpiece: scanning systems, i.e. devices involving movement of the laser beam relative…
B23K 26/0823
Devices involving relative movement between laser beam and workpiece: devices involving rotation of the workpiece
B23K 26/0861
Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane: in at least three axial directions

Timeline

25 Aug 2017Application filedUS 16/632,344
18 Jan 2020Assigned to The Japan Steel Works, Ltd.assignment of assignor's interest
11 Jun 2020PublishedUS 2020/0180071 A1
28 Mar 2022Assigned to Jsw Aktina System Co., Ltd.assignment of assignor's interest
27 Jun 2023GrantedUS 11,684,999 B2
12 Oct 2026TodayWithin its term
9 Dec 2038Term endsEstimated, includes 471 days of adjustment

Laser irradiation apparatus

Life of this patent

Laser irradiation apparatus

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims14

Description8,184 words

Description8,184 words

Classification13 codes

Life of this patent

Drawings