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US 11,684,934 B2Granted
Nozzle for cleaning substrate and method of manufacturing the same
AssigneeHs Hi-Tech Co., Ltd.
InventorsBeom Jin Kim, Hyun Sin Kim
Life of this patent
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Abstract
The present invention relates to a nozzle for cleaning a substrate by discharging cleaning liquid to the substrate and a method of manufacturing the nozzle and, more particularly, to a nozzle for cleaning a substrate and a method of manufacturing the nozzle, the nozzle having pressure resistance performance capable of enduring high supply pressure of the cleaning liquid.
Claims8
A nozzle for cleaning a substrate, the nozzle comprising:
- a first body;
- a second body coupled to a lower portion of the first body such that an upper surface of the second body is in contact with a lower surface of the first body;
- an upper flow path part provided in the first body and communicating with a main hole;
- and
- a lower flow path part provided in the second body and connecting the upper flow path part to a discharging hole so as to allow the upper flow path part and the discharging hole to communicate with each other, wherein an open upper portion of the lower flow path part is formed on the upper surface of the second body,
- wherein an upper surface of the upper flow path part and a lower surface of the lower flow path part are vertically spaced apart from each other,
- wherein the upper flow path part comprises:
- a main flow path communicating perpendicularly with a vertical flow path communicating with the main hole;
- and
- a branched section communicating with the main flow path and configured such that an open lower portion of the branched section communicates with the open upper portion of the lower flow path part, and
- wherein the open lower portion of the branched section is formed on the lower surface of the first body.
8 more elements
Dependencies are inferred from the claim text.