Lid body and cooker
AssigneeFoshan Shunde Midea Electrical Heating Appliances Manufacturing Co., Ltd.
InventorFeng Peng
Life of this patent
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AssigneeFoshan Shunde Midea Electrical Heating Appliances Manufacturing Co., Ltd.
InventorFeng Peng
Estimating the term…
A lid body is provided with a lid body wireless transmission device. The lid body wireless transmission device includes a circuit board. The lid body is provided with a mounting cavity for mounting the circuit board, one side of the mounting cavity being open. The circuit board is fixedly mounted in the mounting cavity; moreover, the mounting cavity is potted by means of a potting adhesive and the opening is sealed. The circuit board is potted in the mounting cavity by means of the potting adhesive, so that the circuit board is completely isolated from a cavity in the lid body to ensure that the circuit board does not contact high-temperature steam in the lid body, thereby preventing the occurrence of excessive temperature rise of a component due to that the circuit board contacts high-temperature steam and the occurrence of damages to the circuit board.
A lid assembly, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
No references of this kind are recorded.
Cooking-vessels: pressure-cookers; Lids or locking devices specially adapted therefor
Pressure-cookers; Lids or locking devices specially adapted therefor: control mechanisms for pressure-cookers
Constructional details: lids, covers or knobs
Parts, details or accessories of cooking-vessels: lids or covers for cooking-vessels
About 12 years 3 months of term left · ends 30 Jan 2039 (estimated)
The present disclosure relates to the field of cookers, and particularly relates to a lid body and a cooker comprising the lid body.
When a pressure cooker is in normal operation, slight air leakage often occurs at the exhaust valve core and the float, and high-temperature steam will be injected in the interior of the lid body after the air leakage, which will result in relatively high air temperature and humidity in the interior of the lid body. For a split-type pressure cooker having a wireless transmission function, a circuit board needs to be mounted in the interior of the lid body, in the existing product structure solution, the lid body is provided with a cavity at a position close to the top, the circuit board is horizontally arranged in the cavity, a sealing ring is then fitted at the opening position of the cavity, and finally a cover is designed to press the sealing ring so that the circuit board is sealed in the cavity. However, the sealing ring is prone to aging under the conditions of high temperature and high humidity, the aging of the sealing ring will make it impossible for the cavity in which the circuit board is mounted to be completely sealed, and when air leakage occurs to the product, high-temperature and high-humidity steam will be injected into the cavity, resulting in excessive temperature rise of the circuit board or directly resulting in damages to the circuit board. Therefore, there is much room for improvement in the existing product structure solution.
The present disclosure aims to solve at least one of the technical problems existing in the prior art.
The above and/or additional aspects and advantages of the present disclosure will become apparent and readily understood from the following description of embodiments in conjunction with the drawings:
FIG. 1 is an exploded view of a lid body provided by an embodiment of the present disclosure;
FIG. 2 is a schematic top view of the lid body shown in FIG. 1;
The corresponding relationship between the reference signs and component names in FIGS. 1-14 is as follows:
1 pot lid, 2 inner lid, 21 mounting cavity, 211 guide groove, 22 protruding portion, 3 circuit board, 31 component having a relatively low temperature resistance, 32 component having a relatively high temperature resistance, 4 surface lid, 41 receiving cavity, and 411 stopping rib.
In order that the above-mentioned objectives, features and advantages of the present disclosure can be understood more clearly, a further detailed description of the present disclosure will be given below in connection with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other if there is no conflict.