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US 11,683,038 B1Granted
Adaptive integrated programmable device platform
AssigneeXilinx, Inc.
InventorsSagheer Ahmad, Jaideep Dastidar, Brian C. Gaide, Juan J. Noguera Serra, Ian A. Swarbrick
Life of this patent
Estimating the term…
Abstract
A System-on-Chip includes a first partition configured to implement a first application using of at least a first portion of one or more of a plurality of subsystems of the System-on-Chip and a second partition configured to implement a second application concurrently with the first partition. The second application uses at least a second portion of one or more of the plurality of subsystems. The first partition is isolated from the second partition.
Claims16
A System-on-Chip, comprising:
- a first partition configured to implement a first application using at least a first portion of one or more of a plurality of subsystems of the System-on-Chip;
- and
- a second partition configured to implement a second application concurrently with the first partition, wherein the second application uses at least a second portion of the one or more of the plurality of subsystems;
- wherein the first partition is isolated from the second partition;
- wherein the first partition is firewalled from the second partition;
- and
- wherein memory protection circuitry prevents each partition from accessing portions of memory allocated to the other partition.
4 more elements
A System-on-Chip, comprising:
- a first partition configured to implement a first application using at least a first portion of one or more of a plurality of subsystems of the System-on-Chip;
- and
- a second partition configured to implement a second application concurrently with the first partition, wherein the second application uses at least a second portion of the one or more of the plurality of subsystems;
- wherein the first partition is isolated from the second partition;
- wherein one of the plurality of subsystems is a Network-on-Chip;
- wherein the Network-on-Chip implements a plurality of data paths including first data paths used by the first application and second data paths used by the second application, wherein the first data paths are isolated from the second data paths;
- and
- wherein each data path of the plurality of data paths is controlled by a Quality of Service parameter for the Network-on-Chip.
5 more elements
A System-on-Chip, comprising:
- a first partition configured to implement a first application using at least a first portion of one or more of a plurality of subsystems of the System-on-Chip;
- and
- a second partition configured to implement a second application concurrently with the first partition, wherein the second application uses at least a second portion of the one or more of the plurality of subsystems;
- wherein the first partition is isolated from the second partition;
- and
- wherein:
- the second application is configured to process a first set of signals from a first set of sensors, and wherein the second partition is dynamically reconfigured to implement a third application configured to process a second set of signals from a second and different set of sensors;
- or
- the second application is configured to process a first set of signals from a first set of sensors, and wherein the second partition is dynamically reconfigured to implement a third application configured to implement a different function using the first set of signals from the first set of sensors.
6 more elements
Dependencies are inferred from the claim text.