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US 11,682,595 B2Granted
System and method for warpage detection in a CMOS bonded array
AssigneeWestern Digital Technologies, Inc.
InventorsKirubakaran Periyannan, Daniel Linnen, Jayavel Pachamuthu
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Abstract
A system and method for warpage detection in a CMOS bonded array includes a conductor positioned between bonded contact pads of first and second wafers. The conductor is connected to a continuity check circuit. If the continuity check circuit detects an interruption in conductivity of the conductor, such interruption is indicative of warpage in the first and/or second wafers. In one implementation, the conductor is a serpentine-shaped structure.
Claims20
An integrated circuit comprising:
- a first wafer comprising a first plurality of contact pads;
- a second wafer comprising a second plurality of contact pads, wherein at least some of the first plurality of contact pads are bonded to at least some of the second plurality of contact pads forming a plurality of pillars;
- a conductor positioned in the first and second wafers and parallel to and offset from at least some of the plurality of pillars;
- and
- a continuity check circuit electrically coupled with the conductor and configured to detect warpage in the first and/or second wafers by detecting an interruption in conductivity of the conductor.
2 more elements
An integrated circuit comprising:
- a first wafer comprising a first plurality of electrical contacts;
- a second wafer comprising a second plurality of electrical contacts, wherein at least some of the first plurality of electrical contacts are bonded to at least some of the second plurality of electrical contacts forming a plurality of pillars;
- and
- means for detecting warpage in at least one of the first and second wafers, wherein the means for detecting warpage comprises a conductor that is parallel to and offset from at least some of the plurality of pillars.
1 more element
A method for detecting warpage comprising:
- providing an integrated circuit comprising:
- a first wafer comprising a first plurality of contact pads;
- a second wafer comprising a second plurality of contact pads, wherein at least some of the first plurality of contact pads are bonded to at least some of the second plurality of contact pads forming a plurality of pillars;
- a conductor positioned in the first and second wafers and parallel to and offset from at least some of the plurality of pillars;
- and
- a continuity check circuit electrically coupled with the conductor;
- applying current through the conductor;
- and
- using the continuity check circuit electrically to detect warpage in the first and/or second wafers by detecting an interruption in conductivity of the conductor.
6 more elements
Dependencies are inferred from the claim text.