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US 11,680,187 B2Granted
Polishing liquid, method for manufacturing glass substrate, and method for manufacturing magnetic disk
AssigneeHoya Corporation
InventorToshio Takizawa
Life of this patent
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Abstract
Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, and a difference between D95 and D5 is 3 μm or more.
Claims20
A polishing liquid that contains cerium oxide as loose abrasive particles and is to be used in polishing processing for polishing a surface of a glass substrate,
- wherein, a particle diameter Dx (μm) is when a cumulative particle volume cumulated from small particle diameter side reaches x (%) of a total particle volume in a particle size distribution obtained regarding the cerium oxide using a laser diffraction/scattering method,
- DS is 1 μm or less,
- D100 is 3 μm or more,
- D50 is 0.8 to 2.4 μm, and
- Dpeak-DS is less than D95-Dpeak.
2 more elements
Dependencies are inferred from the claim text.