Chemical mechanical polishing pad and preparation thereof
AssigneesRohm and Haas Electronic Materials CMP Holdings, Inc., Dupont Electronics, Inc.
InventorsBainian Qian, Robert M. Blomquist, Lyla M. El-Sayed, Michael E. Mills, Kancharla-Arun Reddy, Bradley K. Taylor, Shijing Xia
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Abstract
The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.
Claims9
A process for making an extruded sheet to be used as a polishing layer in a chemical mechanical polishing pad suitable for polishing at least one of a semiconductor substrate, an optical substrate and a magnetic substrate, the process comprising:
- (a) compounding a photopolymerizable composition comprising a block copolymer, a UV curable acrylate, and a photoinitiator in an extruder, wherein the photopolymerizable composition does not contain any organic solvent;
- (b) extruding the compounded mixture of step (a) onto a support through a sheet die;
- (c) passing the product of step (b) through a plurality of calendar rolls;
- (d) exposing the product of step (c) to a source of UV light;
- wherein said block copolymer is present at an amount of greater than 50 wt %, based on the total weight of an extruded sheet, and wherein after the UV curing in step (d), the extruded sheet having a Shore D hardness in the range of 40 to 70.
Dependencies are inferred from the claim text.