Nanoparticle backside die adhesion layer

A method of forming a microelectronic device, the method comprising:

• providing a microelectronic substrate including a microelectronic die with at least one microelectronic component, the microelectronic substrate having a die attach surface;
• providing a nanoparticle layer coupled to the die attach surface, the nanoparticle layer including nanoparticles, wherein adjacent nanoparticles are adhered to each other;
• providing a package substrate having a substrate interface surface coupled to the nanoparticle layer;
• and
• forming a layer of a die attach material that connects the nanoparticle layer to the package substrate, wherein the die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles in an interlocking configuration, and configured to increase a mechanical adhesion between the die attach surface and the package substrate, wherein a gap extends through the nanoparticle layer and the die attach material, the gap extending from the die attach surface to the substrate interface surface.

A microelectronic device, comprising:

• a microelectronic die having a die attach surface;
• a nanoparticle layer coupled to and covering areas of the die attach surface, the nanoparticle layer including nanoparticles, wherein adjacent nanoparticles are adhered to each other;
• a package substrate having a substrate interface surface coupled to the nanoparticle layer;
• and
• a layer of a die attach material connecting the nanoparticle layer to the package substrate, wherein the die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles;
• and
• a gap in and extending through the nanoparticle layer and the die attach material layer, the gap extending from the die attach surface to the substrate interface surface, and wherein a gap extends through the nanoparticle layer and the die attach material layer, the gap extending from the die attach surface to the substrate interface surface.