Photosensitive compound, photosensitive composition, and patterning method
AssigneeIndustrial Technology Research Institute
InventorsYao-Jheng Huang, Te-Yi Chang, Chin-Hua Chang, Ming-Tzung Wu, Yu-Ying Hsu
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Abstract
A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.
Claims10
A photosensitive compound, having a chemical structure of:
- wherein each of R is independently of hydrogen, C1-10 alkyl group, hydroxy group, or C1-10 alkoxy group;
- and
- D is
Dependencies are inferred from the claim text.