Film formation device and film formation method for metal plating film

A film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution electroless plating method, the film formation device comprising:

• a conductive mounting base adapted to install a base material having the plating film of the second metal;
• a third metal installed on the conductive mounting base;
• an insulating material installed on the conductive mounting base;
• a microporous membrane adapted to be impregnated with a substitution electroless plating bath containing ions of the first metal, the substitution electroless plating bath containing the ions of the first metal being delivered to the plating film of the second metal on the base material through the microporous membrane;
• a plating bath chamber provided with an opening portion in which the microporous membrane is installed, the plating bath chamber being adapted to house the substitution electroless plating bath containing the ions of the first metal;
• and
• a press adapted to relatively press the plating bath chamber and the base material against each other after bringing the microporous membrane and the plating film of the second metal on the base material into contact with each other,
• wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and
• wherein the insulating material is installed between the base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.