Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
AssigneeLintec Corporation
InventorMasakazu Ishikawa
Life of this patent
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Abstract
A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.
Claims14
A dielectric welding film configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film comprising:
- a first thermoplastic resin as an A1 component having a predetermined first solubility parameter (δ1);
- a second thermoplastic resin as an A2 component, the second thermoplastic resin having a second solubility parameter (δ2) larger than the first solubility parameter of the first thermoplastic resin;
- and
- a dielectric filler as a B component,
- wherein the A1 component and the A2 component are directly mixed with each other as adhesive components,
- the A1 component is a polyolefin resin and the A2 component is a polyester resin or maleic anhydride modified polypropylene,
- the B component is at least one compound selected from the group consisting of zinc oxide and silicon carbide, and
- a content of the B component is in a range from 50 to 600 parts by mass with respect to 100 parts by mass of a total amount of the A1 component and the A2 component.
A welding method using a dielectric welding film configured to weld a pair of adherends of the same material or different materials through dielectric heating, comprising steps (1) and (2) of:
- (1) holding the dielectric welding film between the pair of adherends;
- and
- (2) applying the dielectric heating on the dielectric welding film held between the pair of adherends with a dielectric heater by applying a high-frequency wave of 1 to 100 MHz frequency,
- wherein the dielectric welding film comprising a first thermoplastic resin as an A1 component having a predetermined first solubility parameter (δ1), a second thermoplastic resin as an A2 component having a second solubility parameter (δ2) larger than the first solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component, and
- wherein a content of the B component is in a range from 50 to 600 parts by mass with respect to 100 parts by mass of a total amount of the A1 component and the A2 component, the A1 component and the A2 component are directly mixed with each other as adhesive components, the A1 component is a polyolefin resin and the A2 component is a polyester resin or maleic anhydride modified polypropylene, and the B component is at least one compound selected from the group consisting of zinc oxide and silicon carbide.
Dependencies are inferred from the claim text.