Mold for encapsulating a Pin-Fin type power module and method for manufacturing a power module
AssigneeZF Friedrichshafen AG
InventorWei Liu
Life of this patent
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Abstract
A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.
Claims11
A mold for encapsulating a Pin-Fin type power module with resin, the power module comprising a Direct Bonded Copper, DBC, or Insulated Metal Substrate, IMS, a plurality of power chips and a plurality of terminals provided on a first surface of the DBC or IMS, a Pin-Fin structure provided on a second surface of the DBC or IMS, the second surface being opposite to the first surface, the mold comprising:
- a cavity for containing the power module;
- a plurality of terminal protecting elements corresponding to the plurality of terminals, each of the plurality of terminal protecting elements receiving at least a portion of a respective terminal of the plurality of terminals;
- and
- an injection hole provided on the bottom of the mold or on the side wall of the mold,
- wherein the first surface of the DBC or IMS faces an inner bottom surface of the mold when the power module is placed in the cavity, and the injection hole is below the first surface of the DBC or IMS when the power module is placed in the cavity.
A method for manufacturing a Pin-Fin type power module, the power module comprising a Direct Bonded Copper, DBC, or Insulated Metal Substrate, IMS, a plurality of power chips and a plurality of terminals provided on a first surface of the DBC or IMS, a Pin-Fin structure provided on a second surface of the DBC or IMS, the second surface being opposite to the first surface, the method comprising:
- placing the power module in a cavity such that each of a plurality of terminal protecting elements receives at least a portion of a respective terminal of the plurality of terminals, such that the first surface of the DBC or IMS faces an inner bottom surface of the mold, and such that an injection hole on a bottom of the mold or on a side wall of the mold is below the first surface of the DBC or IMS;
- and
- injecting epoxy resin via the injection hole so that the first surface is encapsulated with the epoxy resin.
Dependencies are inferred from the claim text.