Assembly and method for sealing a bundle of wires
AssigneeTE Connectivity Solutions GmbH
InventorsSunny Sethi, Vijay Daga, Kavitha Bharadwaj, Ting Gao
Life of this patent
Estimating the term…
Abstract
A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.
Claims20
A structure for creating a sealed wire bundle comprising:
- a first adhesive material in the form of a circular or semi-circular shape, the first adhesive material having a first outer wall, the first adhesive material having a first viscosity;
- first wire receiving spaces;
- first spoke arms extend inward from the first outer wall, the first wire receiving spaces are provided between the first spoke arms;
- wherein wires are positioned in the first wire receiving spaces;
- wherein as heat is applied to the structure, the first adhesive material flows to fill voids between the plurality of wires to thereby seal the wires.
A structure for creating a sealed wire bundle comprising:
- a first adhesive material in the form of a circular or semi-circular shape, the first adhesive material having a first outer wall, the first adhesive material having a first viscosity;
- first wire receiving spaces;
- the first outer wall includes at least one gap;
- wherein wires are positioned in the first wire receiving spaces;
- wherein the at least one gap facilitates insertion of wires through the first outer wall and into the first wire receiving spaces;
- wherein as heat is applied to the structure, the first adhesive material flows to fill voids between the plurality of wires to thereby seal the wires.
A structure for creating a sealed wire bundle comprising:
- a first adhesive material in the form of a circular or semi-circular shape, the first adhesive material having a first outer wall, the first adhesive material having a first viscosity;
- a second adhesive material in the form of a circular or semi-circular shape, the second adhesive positioned on a first side of the first adhesive material, the second adhesive material having a second viscosity;
- a third adhesive material in the form of a circular or semi-circular shape, the third adhesive positioned on a second side of the first adhesive material, the third adhesive material having a third viscosity;
- first wire receiving spaces;
- wherein wires are positioned in the first wire receiving spaces;
- wherein as heat is applied to the structure, the first adhesive material flows to fill voids between the plurality of wires to thereby seal the wires.
Dependencies are inferred from the claim text.