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US 11,667,813 B2Granted
Structural adhesives
AssigneeZephyros, Inc.
InventorMichael Czaplicki
Life of this patent
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Abstract
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.
Claims20
An adhesive formulation comprising:
- i) an adduct of an epoxy resin and an elastomer, wherein the adhesive formulation contains from about 7% to about 20% by weight of the adduct based on the adhesive formulation;
- ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product;
- iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;
- and
- iv) one or more additional epoxy resins;
- and
- wherein the adhesive formulation includes between about 55% by weight and about 70% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins;
- and
- wherein the adhesive formulation contains between 3% and 10% by weight of the phenoxy resin.
6 more elements
Dependencies are inferred from the claim text.