System for creating a relief pattern on a substrate
AssigneeHighcon Systems Ltd.
InventorsRon Or, Michael Karp, Claudio Rottman
Life of this patent
Estimating the term…
Abstract
A die and counter die system for impressing a relief pattern onto a substrate, including a male die film and at least one female die. The female die includes a female-die contact surface including at least one cavity defining the relief pattern. The male die film includes a flexible male-die contact surface which is featureless in a region thereof opposing the relief pattern on the at least one female die. The system further includes a compression mechanism adapted, when the substrate is disposed between the male die contact surface and the female die contact surface, to move the male die film and the at least one female die towards one another so as to impress the relief pattern on the substrate.
Claims20
A system for impressing a relief pattern on a substrate, the system comprising:
- at least one female die including a female-die contact surface, said female-die contact surface including at least one cavity defining the relief pattern, wherein at least part of the relief pattern is defined on a bottom surface of said cavity;
- and
- a compressible male die film including a flexible male-die contact surface spaced from said female-die contact surface, said male-die contact surface being featureless in a region thereof opposing the relief pattern on said at least one female die;
- and
- a compression mechanism adapted to move said male die film and said at least one female die towards one another in an operative mode,
- wherein, in said operative mode, when the substrate is disposed between said male-die contact surface and said female-die contact surface, said compression mechanism moves said male die film and said at least one female die towards one another such that said female-die contact surface engages a first broad surface of the substrate and said male-die contact surface engages an opposing broad surface of the substrate so that said substrate is urged into said cavity to engage said relief pattern on said bottom surface so as to impress the relief pattern on the substrate.
A method for impressing a relief pattern on a substrate, the method comprising:
- placing a substrate between at least one female die and a male die film,
- wherein the at least one female die includes a female-die contact surface including at least one cavity defining the relief pattern, wherein at least part of the relief pattern is defined on a bottom surface of said cavity,
- and wherein the male die film includes a flexible male-die contact surface spaced from said female-die contact surface, said male-die contact surface being featureless in a region thereof opposing the relief pattern on said at least one female die;
- and
- moving said at least one female die and said male die film towards one another such that said female-die contact surface engages a first broad surface of the substrate and said male-die contact surface of said male die film engages an opposing broad surface of the substrate so that said substrate is urged into said cavity to engage said relief pattern on said bottom surface so as to impress the relief pattern on the substrate.
Dependencies are inferred from the claim text.