Semiconductor package with temporary ESD protection element
AssigneeInfineon Technologies Austria AG
InventorsRabie Djemour, Muhammad Khairullah Nor Azmi
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Abstract
A semiconductor device includes a semiconductor package including an encapsulant body of electrically insulating encapsulant material, a semiconductor die encapsulated by the encapsulant body, and two or more leads that are each electrically connected to the semiconductor die, and an ESD protection element that is electrically connected between the two or more leads, and the ESD protection element is configured to be electrically disconnected from the two or more leads by an external stimulus applied to ESD protection element that is non-destructive to the semiconductor package.
Claims20
A semiconductor device, comprising:
- a singulated semiconductor package comprising an encapsulant body of electrically insulating encapsulant material, a semiconductor die encapsulated by the encapsulant body, and two or more leads that are each electrically connected to the semiconductor die;
- and
- an ESD protection element that is electrically connected between the two or more leads, and
- wherein the ESD protection element is configured to be electrically disconnected from the two or more leads by an external stimulus applied to the ESD protection element that is non-destructive to the semiconductor package.
A method of providing a semiconductor device, the method comprising:
- providing a singulated semiconductor package that comprises:
- an encapsulant body of electrically insulating encapsulant material;
- a semiconductor die encapsulated by the encapsulant body;
- two or more leads that are each electrically connected to the semiconductor die;
- and
- electrically connecting an ESD protection element between the two or more leads, and wherein the ESD protection element is configured to disconnect from the two or more leads by an external stimulus that is non-destructive to the semiconductor package.
Dependencies are inferred from the claim text.