Cleaning mechanisms for build material level sensors
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid Soriano, Douglas Pederson, Nicola Baldo, Steve Ringwald, Samrin Sing, Matthew Baker
Life of this patent
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Abstract
In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.
Claims9
A build material level sensor, comprising:
- a capacitive sensor;
- a processor communicatively coupled to the capacitive sensor to interpret a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the build material level sensor, wherein the layer of residual build material comprises build material that is stuck on the capacitive sensor in an otherwise empty build material dispenser;
- and
- a cleaning mechanism communicatively coupled to the processor, wherein the processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the build material level sensor.
Dependencies are inferred from the claim text.