High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorYukiteru Sugaya
Life of this patent
Estimating the term…
Abstract
A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.
Claims16
A high-frequency module comprising:
- a module substrate that includes an internal wiring pattern;
- a surface acoustic wave filter that is disposed on the module substrate;
- and
- a resin member that covers the surface acoustic wave filter;
- wherein
- the surface acoustic wave filter includes:
- a piezoelectric substrate;
- an electrode pattern that is provided on the piezoelectric substrate;
- a support that is provided on a surface of the piezoelectric substrate so as to surround the electrode pattern;
- and
- a cover that is provided on the support and that covers the electrode pattern so as to define a hollow space together with the support and the piezoelectric substrate;
- the module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate;
- a shield electrode that is grounded is provided in or on a surface of the cover that faces the module substrate or is provided in or on a surface of the cover that faces the piezoelectric substrate;
- a wiring pattern is connected to the electrode pattern and is provided in or on the resin member;
- and
- the electrode pattern and the wiring pattern are inductively coupled or capacitively coupled to each other.
Dependencies are inferred from the claim text.