Method for preparing electrode of inductive component

A method for preparing an electrode of an inductive component, comprising:

• S1:
• performing surface insulation treatment, comprising:
• placing the inductive component in a spraying pot with a pot body angle of 25-65° and a rotating speed of 100-200 r/min, and performing thermal spraying resin by using a fixed spray gun for performing surface insulation treatment, wherein a thermal spraying temperature is 50-110° C., a spraying time is 60-180 min, and a coating thickness of the resin is 0.005-0.015 mm;
• S2:
• exposing an inner electrode, comprising:
• processing an electrode area through laser or mechanical polishing to expose the inner electrode, wherein a depth of the processing is 0.015-0.025 mm;
• S3:
• performing surface pretreatment, comprising:
• performing degreasing and surface pretreatment with ultrasound in an alkaline solution, wherein an ultrasonic time is not greater than 30 min;
• S4:
• performing surface activation treatment, comprising:
• performing surface activation treatment with ultrasound in a low-concentration acid solution, wherein an ultrasound time is 20-40 s and an ultrasound temperature is 0-40° C.;
• wherein a mass fraction of the low-concentration acid solution in S4 is 0.5% to 3%;
• S5:
• electroplating to form a metal layer, comprising:
• S5.1:
• electroplating in an electrolytic cell to form an electroplated copper layer, wherein a thickness of the electroplated copper layer is 0.006-0.014 mm;
• wherein an anode material for the electroplating is an electrolytic copper ball or a pure copper plate, and a cathode material for the electroplating is the inductive component;
• an electrolyte for the electroplating is a mixed solution of a copper sulfate solution with a mass concentration of 140-160 g/L, a copper chloride solution with a mass concentration of 40-80 g/L, and a sulfuric acid with a mass concentration of 40-60 g/L;
• and a current density is 2-4 A/dm2, an electroplating time is 45-55 min, and an electroplating temperature is 40-50° C.;
• S5.2:
• electroplating in an electrolytic cell to form an electroplated nickel layer, wherein a thickness of the electroplated nickel layer is 0.001-0.005 mm;
• wherein an anode material for the electroplating is an electrolytic nickel ball or a pure nickel plate, and a cathode material for the electroplating is the inductive component;
• an electrolyte for the electroplating is a mixed solution of a nickel sulfamate solution with a mass concentration of 90-110 g/L, a nickel chloride solution with a mass concentration of 40-60 g/L, a boric acid solution with a mass concentration of 30-50 g/L, and a sulfamic acid with a mass concentration of 25-35 g/L;
• and a current density is 3-5 A/dm2, an electroplating time is 25-35 min, and an electroplating temperature is 50-60° C.;
• and
• S5.3:
• electroplating in an electrolytic cell to form an electroplated tin layer, wherein a thickness of the electroplated tin layer is 0.002-0.006 mm;
• wherein an anode material for the electroplating is an electrolytic tin ball or a pure tin plate, and a cathode material for the electroplating is the inductive component;
• an electrolyte for the electroplating is a mixed solution of a stannous sulfate solution with a mass concentration of 45-65 g/L, and a sulfamic acid with a mass concentration of 40-50 g/L;
• and a current density is 3-9 A/dm2, an electroplating time is 15-25 min, and an electroplating temperature is 20-30° C.;
• and
• S6:
• performing surface post-treatment, comprising:
• performing neutralization cleaning and anti-oxidation treatment first, then performing cleaning with pure water, and finally performing vacuum drying to complete preparation of the electrode of the inductive component.