Printed circuit board automated layup system

An apparatus to automatically place layers of a printed circuit board on a fixture, the apparatus comprising:

• a robotic device including
• a base that is secured to a surface,
• an upright column that extends upwardly from the base, and
• a movable arm rotatably coupled to the upright column, the movable arm being configured to rotate about a vertical axis defined by the upright column, and further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture,
• wherein the movable arm of the robotic device further is configured to move in x- axis and y-axis directions,
• wherein the movable arm is configured to vary a radius of arc and travel about the vertical axis and configured to lower and raise an end effector supported by the movable arm in the z-axis direction,
• wherein the movable arm includes a user flange that is configured to receive and mount thereon the end effector,
• wherein the end effector includes an actuator that is secured to the user flange and to a fixed plate, the movable arm being configured to move the fixed plate vertically in the z-axis direction, and
• wherein the fixed plate is disposed on a horizontal plane and supports a vacuum tool having top floating plate and a bottom floating plate, which is secured to the top floating plate, the top floating plate and the bottom floating plate being configured to move relative to the fixed plate in the x-axis and y-axis directions.