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US 11,649,589 B2Granted
Adhesive having insulative properties
AssigneeHenkel AG & Co. KGaA
InventorsTianjian Huang, Robert Sandilla, Daniel Waski
Life of this patent
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Abstract
An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.
Claims8
A method of making a multilayer substrate package comprising:
- (a) providing a first substrate, which is substantially flat, having a first and a second side;
- (b) preparing an adhesive composition having insulative properties, comprising (i) an amylose starch component;
- (ii) an alkaline component;
- (iii) sodium tetraborate;
- (iv) water;
- and (v) a plurality of expandable microspheres;
- (c) applying the adhesive composition onto the first side of the first substrate;
- (d) providing a second substrate, which is substantially flat, having a first and a second side;
- (e) contacting the first side of the second substrate directly on the adhesive composition to form the multilayer substrate package;
- (f) applying heat or radiation to the multilayer substrate package;
- whereby the adhesive composition gelatinizes to a moisture content of at least 10% and secures the first substrate to the second substrate;
- (g) expanding the plurality of expandable microspheres;
- and
- (h) setting the adhesive composition.
11 more elements
Dependencies are inferred from the claim text.