Method to achieve tilted patterning with a through resist thickness using projection optics

A lithographic patterning system, comprising:

• an actinic radiation source, wherein the actinic radiation source is configured to propagate light along an optical axis;
• a mask mount, wherein the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis;
• a lens module;
• a substrate mount, wherein the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis;
• a substrate mounted in the substrate mount;
• a prism over the substrate;
• and
• an index of reflection matching layer between the prism and e substrate.

A lithographic patterning system, comprising:

• an actinic radiation source, wherein the actinic radiation source is configured to propagate light along an optical axis;
• a mask mount, wherein the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis;
• a lens module;
• a substrate mount, wherein the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis;
• and
• an aligns ent camera, wherein the alignment camera comprises an autocollimator and a distance detector.